Slicing Machine - Company Ranking(5 companies in total)
Last Updated： Aggregation Period:Jul 22, 2026〜Aug 18, 2026
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Featured Products (Partial)】 ■ General-purpose Slicing Machines ・TS-4020SM ・TS-5020SM ・TS-6030SM ■ General-purpose Grinding Machines ・T... | For more details, please refer to the PDF document or feel free to contact us. | ||
| 【Specifications (Partial)】 ■ Table dimensions: φ550mm ■ Grinding wheel dimensions (outer diameter × inner diameter): φ125–200×40mm ■ Grindin... | [Target] ■ Precision cutting of thin plates such as wafer boards, glass plates, ceramic plates, and carbon plates. *For more details, p... | ||
| 【Specifications (Partial)】 ■ Table dimensions (length × width): 1300 × 500 mm ■ Grinding wheel head vertical stroke: 440 mm ■ Distance from ... | [Target] ■ Various difficult-to-cut materials and brittle materials such as wafer boards, glass plates, ceramic plates, and carbon plates. ... | ||
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東京精機工作所
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- Featured Products
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Tokyo Seiki Manufacturing Company General Catalog
- overview
- 【Featured Products (Partial)】 ■ General-purpose Slicing Machines ・TS-4020SM ・TS-5020SM ・TS-6030SM ■ General-purpose Grinding Machines ・T...
- Application/Performance example
- For more details, please refer to the PDF document or feel free to contact us.
Round Table Type Slicing Machine "TSA550 Model"
- overview
- 【Specifications (Partial)】 ■ Table dimensions: φ550mm ■ Grinding wheel dimensions (outer diameter × inner diameter): φ125–200×40mm ■ Grindin...
- Application/Performance example
- [Target] ■ Precision cutting of thin plates such as wafer boards, glass plates, ceramic plates, and carbon plates. *For more details, p...
Corner table type slicing machine "TSA-50150 model"
- overview
- 【Specifications (Partial)】 ■ Table dimensions (length × width): 1300 × 500 mm ■ Grinding wheel head vertical stroke: 440 mm ■ Distance from ...
- Application/Performance example
- [Target] ■ Various difficult-to-cut materials and brittle materials such as wafer boards, glass plates, ceramic plates, and carbon plates. ...
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東京精機工作所
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